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Blue Negative 16x2 Lcd Module , White LED Lcd Character Display Wide Viewing Angle

Blue Negative 16x2 Lcd Module , White LED Lcd Character Display Wide Viewing Angle

stn lcd module

monochrome lcd display module

Place of Origin:

Dongguan, China

Brand Name:

FangSheng

Certification:

ISO9001:2015

Model Number:

FS1602G

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Product Details
LCD Type:
COB
Polarizer Mode:
Transflective
Display Mode:
Positive
Viewing Angle:
6'clock
Storage Temp:
-20--+60℃
Back Light:
White LED Backlight
Highlight:

stn lcd module

,

monochrome lcd display module

Payment & Shipping Terms
Minimum Order Quantity
500
Price
Negotiation
Packaging Details
Bubble bag + Blister + Foam box + Carton
Delivery Time
3-5 Working Days
Payment Terms
T/T,Western Union, Paypal, D/A, D/P, L/C
Supply Ability
200K Sets / Month
Product Description

 

16 x 2 dot matrix Character STN LCD Display in STN Positive Gray LCD Mode

 

A 16x2 dot matrix Character LCD Module display in STN Negative Blue LCD Mode, Six O'clock viewing direction, Normal Temperature Range (Operating Temp: 0°C to 50°C, Storage Temp: -20°C to 60°C), and White LED Backlight. It has a transmissive polarizer suitable for darker environment. This product is assembled Chip On board with 1/16 Duty and a Controller IC S6A0069 or equivalent. The interface type is Parallel. This is an ROHS Compliant product manufactured with ISO standards and procedures.

 

Specifications

  • Number of Characters: 16 characters x 2 Lines
  • Character Table: English-European (RS in Datasheet)
  • Module dimension: 80.0mm x 36.0mm x 13.2mm(MAX)
  • View area: 66.0 x 16.0 mm
  • Active area: 56.2 x 11.5 mm
  • Dot size: 0.56 x 0.66 mm
  • Dot pitch: 0.60 x 0.70 mm
  • Character size: 2.96 x 5.46 mm
  • Character pitch: 3.55 x 5.94 mm
  • LCD type: STN, Negative, Transmissive, Blue
  • Duty: 1/16
  • View direction: Wide viewing angle
  • Backlight Type: white LED
  • RoHS Compliant: lead free
  • Operating Temperature: -20°C to + 70°C

 

A chip-on-board is a chip that is wired directly to the motherboard. The chip is usually covered with a coating of epoxy or resin to protect it the way a heatsink does, as well as protecting the chips and wires from damage. This is where the term “glop-top” comes from. It is a cost-effective method of electronic packaging, but the disadvantage is that a chip cannot be replaced without desoldering, the way a socketed chip can. COBs are popular in small circuit boards because they require little physical space the way a heatsink does.

 

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